Job Description
Packaging Manufacturing Engineer, Quantum AI
_corporate_fare_ Google _place_ Goleta, CA, USA
**Mid**
Experience driving progress, solving problems, and mentoring more junior team members; deeper expertise and applied knowledge within relevant area.
**Minimum qualifications:**
+ Bachelor’s degree in Mechanical, Electrical, or Manufacturing Engineering or equivalent practical experience.
+ 2 years of experience working with electronics packaging, including wire bonding, die preparation, or printed circuit boards (PCBs).
+ 2 years of experience designing, manufacturing, or testing PCBs.
+ 2 years of experience managing production processes (vendor management, continuous process improvements, tool ownership, or monitoring and control of existing processes).
+ Experience using statistical process control (SPC) and design of experiments (DOE) to develop or improve manufacturing processes.
**Preferred qualifications:**
_corporate_fare_ Google _place_ Goleta, CA, USA
**Mid**
Experience driving progress, solving problems, and mentoring more junior team members; deeper expertise and applied knowledge within relevant area.
**Minimum qualifications:**
+ Bachelor’s degree in Mechanical, Electrical, or Manufacturing Engineering or equivalent practical experience.
+ 2 years of experience working with electronics packaging, including wire bonding, die preparation, or printed circuit boards (PCBs).
+ 2 years of experience designing, manufacturing, or testing PCBs.
+ 2 years of experience managing production processes (vendor management, continuous process improvements, tool ownership, or monitoring and control of existing processes).
+ Experience using statistical process control (SPC) and design of experiments (DOE) to develop or improve manufacturing processes.
**Preferred qualifications:**
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