Job Description

Division

R&D

Department

EV Electronics

Level

Ex

Functional Area

HVDC hardware

1

Job Title

Manager (R&D)

2

Reporting

Leadership, R&D – EV Electronics

3

Educational Qualification

B.E/ B Tech in Electrical, Electronics/Instrumentation and Equivalent Streams, M Tech in Power Electronics (preferred),

PhD in Power Electronics domain, min 70% in all levels of education

Experience

4 to 12 yrs

Age Limit

NA

4

Job Role & Responsibilities

Role: Power Electronics Engineer

Technical/Functional:

  • PCB Layout Design for Power Electronics:Design multi-layer PCBs for high-power motor controllers, DC-DC converters, inverters, and battery management systems (BMS).Optimize power planes, creepage & clearance distances, and thermal dissipation for high-voltage (>96V) and high-current applications.Ensure low-inductance routing, controlled impedance, and effective grounding strategies for high-power circuits.Select appropriate PCB materials (FR4, Rogers, Polyimide, etc.) for high-reliability applications.Implement EMI/EMC best practices, including shielding, filtering, and differential pair routing.
  • PCB Layout for RF & High-Speed Designs:Design PCBs for RF modules, antennas, and high-speed signal transmission (GHz range).Implement microstrip, stripline, coplanar waveguides, and controlled impedance routing.Optimize layouts for minimum crosstalk, reflection, and insertion loss.Work closely with RF engineers for layout optimization, grounding, and signal integrity enhancements.Conduct EMI simulations and compliance testing to meet RF regulatory standards.
  • PCB Layout for Analog & Mixed-Signal Circuits:Design low-noise, precision analog circuit layouts, including op-amps, ADCs, DACs, and sensor interfaces.Implement star-grounding, guard rings, and Kelvin sensing techniques for ultra-low- noise performance.Optimize high-precision data acquisition and mixed-signal PCB layouts.Ensure minimized parasitic capacitance and inductance in sensitive analog circuits.
  • Thermal & Mechanical Considerations:Design thermal vias, heat sinks, copper pours, and metal core PCBs (MCPCB) for high-power applications.Work closely with mechanical engineers to optimize PCB integration within enclosures and cooling solutions.Work closely with CFTs to perform thermal simulations and power dissipation analysis for PCB heat management.
  • Design Validation & Compliance:Perform DFM (Design for Manufacturability), DFA (Design for Assembly), and DFT (Design for Testability) analysis.Collaborate with fabrication and assembly vendors to ensure high-yield production.Ensure compliance with IPC standards (IPC-2221, IPC-600, IPC-6012), EMI/EMC regulations, and automotive/industrial safety norms.

    • 5

    Competency Requirements

    Behavioral:

  • Demonstrates excellent communication skills, both written and verbal.
  • Serves as an effective team player with the capability to lead and mentor a group of engineers.
  • Anticipates challenges, takes proactive actions, and fosters a culture of continuous improvement.
  • Creates and maintains comprehensive technical documentation, including design calculations.
  • Encourages innovation in technology and cost optimization, promoting intellectual property (IP) generation within the team.
  • Possesses the ability to transform concepts into practical, real-world solutions.
  • Communicates effectively with team members, peers, suppliers, and senior leadership.
  • Collaborates seamlessly with cross-functional teams to develop innovative and impactful solutions.

    • Specific expertise required for functional domain:

  • PCB layout tools: Altium Designer, Cadence Allegro, Mentor Xpedition, KiCad, Eagle, or OrCAD.
  • Power electronics PCB design: High-voltage (>96V), high-current layouts, creepage/clearance design.
  • RF PCB layout: Controlled impedance, high-frequency design, shielding, and SI/PI analysis.
  • Analog circuit PCB layout: Low-noise routing, precision signal integrity, and EMI/EMC mitigation.
  • DFM/DFA considerations: PCB stack-up design, material selection, thermal & mechanical integration.
  • Simulation tools: Ansys SIwave, HyperLynx, LTspice, CST Studio, Keysight ADS for RF/mixed-signal analysis.
  • Knowledge of PCB fabrication & assembly: HDI, flex-PCB, rigid-flex, metal core PCBs (MCPCB).

    • 6

    Likely sources

    Bosch, Philips, GE, Eaton, Ather, OLA, Matter Motor

    Apply for this Position

    Ready to join ? Click the button below to submit your application.

    Submit Application