Job Description

Role : Sr Physical Design Lead/BE Integration

This position is for senior level engineer Full Chip Physical Design/Integrations/ SoC Floor planning/Bump Planning/ Pin Assignments /Feed through/ LFU Optimization/Physical Verification, Power design/implementation/signoff. He must have hands on Physical Design experience and must have handled RTL to GDS II at Top level

Key Responsibilities:

  • Expertise in hierarchical RTL2GDSII design implementation
  • Expertise in pin assignment, Power planning, IO/Bump Planning, Pad Ring Creation, Die File Creation, RDL Routing, working with Package Team for Optimize the Bumps
  • Full chip Hierarchical Floor Planning, Block planning , block level constraints, hierarchical clock tree implementation, block integration and chip finishing for Analog-Mixed Signals.
  • Experience in debugging LVS issues at chip-level with complex analog-mixed signal IPs
  • Low power design with power estimation/optimization i...

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