PICs@ICFO Strategic Initiative: Process Engineer or Research Scientist in PIC Packaging

As part of the Strategic Initiative , ICFO is currently coordinating the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project —two flagship programs aimed at advancing Photonic Integrated Circuits (PICs) in Europe.

We are seeking up to two Process Engineers or Research Scientists with hands‑on experience in packaging and assembly of photonic integrated circuits (PICs). The selected candidate will play a key role in the experimental development of advanced PIC technologies within the strategic initiative.

The position is hands‑on and lab‑oriented, suited for candidates with a solid technical background and a passion for practical work with integrated photonic devices.

Key Responsibilities

• Development and optimization of Photonic Packaging technologies (e.g. die bonding, wire bonding, optical coupling, hybrid integration) on semi‑automated assembly machines – including process programming and set...