Plating Equipment Engineer

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Job Description:

As a Finish Team (Bond, CMP, Plating) Equipment Engineer with Broadcom Limited’s Wireless Semiconductor Division (WSD), you will own and support equipment used to develop and execute advanced processes in our state of the art 8” wafer fabrication facility located along the Front Range in Northern Colorado. Working with Technology Development and Process Engineering, you will be challenged by new materials, applications and device architectures. You will be responsible for establishing robust equipment and processes through rigorous characterization and statistical validation before ramping and supporting them in high volume manufacturing.

Responsibilities