Principal Engineer Package Technology Development

Job Description

To support TPAK/IDPAK platform projects with dual sourcing, cost down, 6to 8-inch wafer conversion TCM and additional customer requirements/qualification for the package.

• Package Design and Development: Design and develop power module and power package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products.
• Technical Advisor: Provide technical guidance and expertise to OSAT partners package technology development, including specifying requirements, developing, verifying, and validating new or modified package technologies.
• Technical Leadership: Drive technical decision-making and set direction within OSAT for the development and pre-development of new package technologies, processes, and materials.
• Problem-Solving and Analysis: Apply a systematic approach to problem-solving, generating analysis, and hypothesis to draw conclusions and derive lessons learned.
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