Principal Engineer Package Technology Development Ipoh (Malaysia) HRC1368918

## Principal Engineer Package Technology DevelopmentIpoh (Malaysia)Erfahren Sie, wie gut Ihr Profil zur Stelle passtTo support TPAK/IDPAK platform projects with dual sourcing, cost down, 6to 8-inch wafer conversion TCM and additional customer requirements /qualification for the package. **Job Description** In your new role you will: * Package Design and Development: Design and develop power module and power package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products.* Technical Advisor: Provide technical guidance and expertise to OSAT partners on package technology development, including specifying requirements, developing, verifying, and validating new or modified package technologies.* Technical Leadership: Drive technical decision-making and set direction within OSAT for the development and pre-development of new package technologies, processes, and materials.* Problem-Solving and Analysis: Apply a systematic approach to proble...