Principal Engineer, Systems Engineering

Job's mission

As a Principal Engineer in Systems Engineering for Advanced Packaging, you'll define and drive system-level architecture for next-generation semiconductor tools. Your expertise will shape critical subsystems and ensure compliance with global standards, enabling breakthrough performance in advanced packaging. Collaborating across engineering disciplines, you'll lead innovation that powers the future of semiconductor technology.

What you will be working on

• Define system-level architecture for advanced packaging semiconductor tools (etch, deposition, etc.).
• Develop requirements for subsystems including vacuum and gas delivery, RF power and plasma, motion control and robotics, thermal management, optics/metrology sensors, and safety systems.
• Lead design reviews (SRR, PDR, CDR) and ensure engineering deliverables meet system performance goals.
• Ensure compliance with SEMI standards, CE/UL, and safety requirements.
• Partner with process engineering to align tool performance with wafer results.
• Lead root cause analysis on complex interactions such as plasma–wafer coupling, thermal gradients, mechanical vibration, and contamination.
• Support product roadmap planning and system-level innovation for next-generation equipment.
• Drive FMEA, reliability engineering, risk assessments, and continuous improvement efforts.
• Collaborate with supply chain and manufacturing engineering to ensure design scalability and robustness.

What we are looking for

• Bachelor's or Master's degree in Systems, Mechanical, Electrical, or related engineering field.
• Minimum 10 years of experience in semiconductor capital equipment (etch, deposition, metrology, etc.).
• Deep understanding of vacuum systems, contamination control, robotics, plasma physics, motion control, or thermal/fluid systems.
• Familiarity with SEMI standards, DFMEA/FMEA, requirements management tools, and structured system engineering processes.

What sets you apart

• Experience leading cross-functional teams in complex system development.
• Strong analytical and problem-solving skills with a focus on innovation.
• Knowledge of advanced packaging trends and emerging semiconductor technologies.
• Excellent communication and collaboration skills to influence across teams.