Job Description

Skyworks is an innovator of high performance analog semiconductors whose solutions are powering the wireless networking revolution. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creativity and out-of-the-box thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together can change the way the world communicates.

Summary

Looking for a Principal Packaging Engineer to support packaging process engineering. The candidate will be lead frame package assembly engineer (leaded and leadless package such as QFN, QSOP, SOIC, etc) mainly and also prefer to laminate package assembly, bumping process experienced who has interface between design teams and SWKS internal/external OSAT manufacturing.

Job Responsibilities

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