Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Overview

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering. We are seeking an Advanced Packaging Integration Engineer to join Micron’s Advanced Packaging Technology Development (APTD) team. Our vision is to transform how the world uses information to enrich life for all. We pursue innovation for customers and partners with integrity, sustainability, and community support. Micron delivers solutions from VR to AI, memory and storage technologies, and is focused on high performance memory products and transfer to manufacturing.

We are currently experiencing a groundbreaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations.

Join a world-class global team focused on enabling high-value technology-driven solutions for customers ...