Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

# **Welcome!**## .Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding) page is loaded## Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)locations: Malaysia, Kulimtime type: Full timeposted on: Posted Todayjob requisition id: JR # **Job Details:**## Job Description:This role requires regular onsite presence to fulfill essential job responsibilities.* Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits.* Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line.* Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost indicator goals.* Grows insitu manufacturing capacity to high volumes ...