Job Description

As a Research Engineer in the Wafer-to-Wafer (W2W) Bonding Module, you will work on Temporary Bonding and Debonding (TBDB) processes?an essential step in advanced semiconductor packaging for handling ultra-thin wafers. This role focuses on process development, optimization, and stabilization to enable next-generation packaging technologies.


Key Responsibilities:


  • Developing and optimizing temporary bonding and debonding processes for wafer-level packaging.


  • Support integration of process flows, ensuring compatibility across multiple steps in advanced packaging including laser debonding and back grinding.


  • Investigate and resolve process issues and defects such as voids, warpage, and delamination.


  • Plan and execute Design of Experiments (DOE) for process development.


  • Collect, analyze data, and document findings in technical reports.

    • Job Requirements:


  • Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.


  • Experience in TBDB process development or advanced packaging technologies is an advantage.


  • Strong analytical and problem-solving abilities.


  • Good communication and teamwork skills.


  • Ability to work in a cleanroom environment and handle precision equipment.

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