Job Description
**Job Family:** Software
**Req ID:** 484768
Siemens Digital Industries Software is a global leader in Electronic Design Automation (EDA) software, hardware, and design solutions. We partner with the world’s leading producers of semiconductor microelectronic circuits and systems, enabling them to design and produce cutting-edge electronic products faster and more efficiently.
We are looking for a **Senior AI/ML Engineer** to join our **Central Engineering Solutions team.**
Your primary responsibility will be to collaborate with a team of experienced professionals and SMEs to understand customer needs and deliver comprehensive, end-to-end workflow solutions for advanced **2.5D and 3D System-in-Package (SiP)** designs. These multi-domain workflows integrate Siemens’ industry-leading **EDA** and **MCAD** tools, enabling architectural planning, physical design and verification, multi-die-based electrical, thermal, and mechanical stress analysis, as well as manufacturing testing for advanced SiP designs.
**Responsibilities:**
+ Design, implement, maintain, test, and document software modules and subsystems, with a strong focus on **AI/ML applications** .
+ Develop scalable, customized, and automated workflows using **Python** , **Tcl/Tk** , **Bash** , and related tools—emphasizing seamless **AI/ML integration** .
+ Apply problem-solving skills to identify and resolve **AI/ML-related design, tool, or flow issues** .
+ Enhance design flows and methodologies for advanced technology nodes.
+ Integrate and optimize **AI/ML-driven workflows** for **SI/PI analysis** , extraction, **3DBlox** , **3DStack** , and **multiphysics simulations** (thermal, mechanical, electrical) for **3D-IC** .
+ Collaborate with CAD, 3D/2.5D packaging, and physical implementation teams to define and refine workflow requirements.
+ Support the development and adoption of **3DBlox** and standards-based solutions for 3D-IC/3DStack architectures.
+ Manage design data and **EDA infrastructure** , including tool installation, environment setup (Linux/Windows), compute resource monitoring, backups, and troubleshooting.
**Qualifications:**
+ Bachelor’s or Master’s degree with +5 years of experience in software development and CAD/design.
+ Strong programming experience in **C++** , **Python** , **Tcl/Tk** , and **Shell/Bash** , with deep expertise in Python for **AI/ML use cases** .
+ Solid understanding of data structures, software design, and development in both **Windows and Linux** environments, particularly for large-scale data processing.
+ Hands-on experience with **Flow Managers/MakeFiles** for building complex design structures and workflows.
+ Proven experience integrating **AI/ML/LLM technologies** into **EDA** or **3D-IC workflows** , focusing on data-driven automation.
+ Demonstrated success using **AI/ML/LLM** techniques for **Design Space Exploration** or **Design Optimization** (e.g., floorplanning, placement, thermal/power optimization, or performance tuning).
+ Strong background in **design data management** and **EDA infrastructure setup** , including system administration, compute environment configuration, and resource management.
+ Understanding of **ASIC design methodologies** from RTL synthesis to physical implementation and Netlist-to-GDS flow.
+ Familiarity with **version control systems** (e.g., Git) and **Agile/Scrum** development practices.
+ Awareness of **2.5D and 3D packaging solutions** (e.g., TSMC InFO, CoWoS, GF GF32, ASE FoCUS, Amkor SWIFT, Samsung MDI).
+ Excellent communication skills in English, with the ability to collaborate effectively with globally distributed teams.
**Preferred Qualifications:**
+ Experience with **AI/ML frameworks** such as **TensorFlow** , **PyTorch** , or **scikit-learn** .
+ Background in **data science** , **machine learning engineering** , or **computational intelligence** .
+ Familiarity with **cloud computing platforms** (AWS, Azure, GCP) for scalable AI/ML deployment.
+ Experience with **Siemens Calibre DRC, LVS, and/or 3DSTACK** solutions.
+ Exposure to **AI-driven 3DBlox** and **3DStack** technologies development or integration.
We’re Siemens. A collection of over 377,000 minds building the future, one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit and business need. Bring your curiosity and creativity and help us shape tomorrow!
Siemens is an equal opportunities employer and do not discriminate unlawfully on any grounds. We are committed to providing access and equal opportunity.
**Organization:** Digital Industries
**Job Type:** Full-time
**Category:** Research & Development
**Req ID:** 484768
Siemens Digital Industries Software is a global leader in Electronic Design Automation (EDA) software, hardware, and design solutions. We partner with the world’s leading producers of semiconductor microelectronic circuits and systems, enabling them to design and produce cutting-edge electronic products faster and more efficiently.
We are looking for a **Senior AI/ML Engineer** to join our **Central Engineering Solutions team.**
Your primary responsibility will be to collaborate with a team of experienced professionals and SMEs to understand customer needs and deliver comprehensive, end-to-end workflow solutions for advanced **2.5D and 3D System-in-Package (SiP)** designs. These multi-domain workflows integrate Siemens’ industry-leading **EDA** and **MCAD** tools, enabling architectural planning, physical design and verification, multi-die-based electrical, thermal, and mechanical stress analysis, as well as manufacturing testing for advanced SiP designs.
**Responsibilities:**
+ Design, implement, maintain, test, and document software modules and subsystems, with a strong focus on **AI/ML applications** .
+ Develop scalable, customized, and automated workflows using **Python** , **Tcl/Tk** , **Bash** , and related tools—emphasizing seamless **AI/ML integration** .
+ Apply problem-solving skills to identify and resolve **AI/ML-related design, tool, or flow issues** .
+ Enhance design flows and methodologies for advanced technology nodes.
+ Integrate and optimize **AI/ML-driven workflows** for **SI/PI analysis** , extraction, **3DBlox** , **3DStack** , and **multiphysics simulations** (thermal, mechanical, electrical) for **3D-IC** .
+ Collaborate with CAD, 3D/2.5D packaging, and physical implementation teams to define and refine workflow requirements.
+ Support the development and adoption of **3DBlox** and standards-based solutions for 3D-IC/3DStack architectures.
+ Manage design data and **EDA infrastructure** , including tool installation, environment setup (Linux/Windows), compute resource monitoring, backups, and troubleshooting.
**Qualifications:**
+ Bachelor’s or Master’s degree with +5 years of experience in software development and CAD/design.
+ Strong programming experience in **C++** , **Python** , **Tcl/Tk** , and **Shell/Bash** , with deep expertise in Python for **AI/ML use cases** .
+ Solid understanding of data structures, software design, and development in both **Windows and Linux** environments, particularly for large-scale data processing.
+ Hands-on experience with **Flow Managers/MakeFiles** for building complex design structures and workflows.
+ Proven experience integrating **AI/ML/LLM technologies** into **EDA** or **3D-IC workflows** , focusing on data-driven automation.
+ Demonstrated success using **AI/ML/LLM** techniques for **Design Space Exploration** or **Design Optimization** (e.g., floorplanning, placement, thermal/power optimization, or performance tuning).
+ Strong background in **design data management** and **EDA infrastructure setup** , including system administration, compute environment configuration, and resource management.
+ Understanding of **ASIC design methodologies** from RTL synthesis to physical implementation and Netlist-to-GDS flow.
+ Familiarity with **version control systems** (e.g., Git) and **Agile/Scrum** development practices.
+ Awareness of **2.5D and 3D packaging solutions** (e.g., TSMC InFO, CoWoS, GF GF32, ASE FoCUS, Amkor SWIFT, Samsung MDI).
+ Excellent communication skills in English, with the ability to collaborate effectively with globally distributed teams.
**Preferred Qualifications:**
+ Experience with **AI/ML frameworks** such as **TensorFlow** , **PyTorch** , or **scikit-learn** .
+ Background in **data science** , **machine learning engineering** , or **computational intelligence** .
+ Familiarity with **cloud computing platforms** (AWS, Azure, GCP) for scalable AI/ML deployment.
+ Experience with **Siemens Calibre DRC, LVS, and/or 3DSTACK** solutions.
+ Exposure to **AI-driven 3DBlox** and **3DStack** technologies development or integration.
We’re Siemens. A collection of over 377,000 minds building the future, one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit and business need. Bring your curiosity and creativity and help us shape tomorrow!
Siemens is an equal opportunities employer and do not discriminate unlawfully on any grounds. We are committed to providing access and equal opportunity.
**Organization:** Digital Industries
**Job Type:** Full-time
**Category:** Research & Development
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