Job Description

A leading semiconductor equipment company in Singapore is seeking an Engineering Design Manager to lead the mechanical and mechatronic design of advanced Thermo-Compression Bonders. The ideal candidate will have extensive experience in semiconductor equipment design, strong proficiency in 3D CAD applications, and a proven track record in the creation of production-ready machines. This is a full-time position that offers senior management responsibilities in an innovative and critical role for the company's success.
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