Job Description

Bonding Process Control Engineer ? Role Summary


We are seeking a Bonding Process Control Engineer responsible for owning, optimizing, and sustaining wafer?level bonding processes?including hybrid wafer?to?wafer bonding, chip?to?wafer bonding, and Temporary Bonding & Debonding (TBDB) across multiple wafer sizes and thicknesses.


This role focuses on process stability, SPC governance, yield improvement, defect reduction, and robust process-control strategies for both development and small?volume prototying. The engineer will play a critical role in enabling next?generation heterogeneous integration and advanced packaging technologies.


Key Responsibilities:


Process Control & SPC Ownership

  • Own and maintain SPC control strategies for bonding processes across multiple toolsets.

  • Define Critical Process Parameters (CPPs) and Critical Quality Attributes (CQAs) such as alignment accuracy, bond strength, defectivity, war...

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