Job Description


Job Description

Responsible for new product setup, process optimization, device qualification & prototype sample build.

Key Responsibilities

  • Lead & drive NPI activities
  • Responsible for new device process window study
  • Perform risk assessment & identify technical challenges
  • New material characteristic study & evaluation
  • Failure analysis & reporting
  • Prototype sample build & characteristic check
  • Propose process conditions for mass production

    • Qualifications
  • Degree in Engineering/Science Discipline
  • Working experience in semiconductor assembly manufacturing or process engineering and pre-assembly process (Wafer back grind, Dicing, Screen Printing, Die Attached & Wire Bonding) is an advantage.
  • Ability to work with minimal supervision
  • Good project management skills
  • Strong problem-solving skills

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