Job Description
A technology company in Malacca, Malaysia is seeking an experienced professional to lead the management of their package platform. Candidates must have a Master's or Bachelor's degree in Engineering, along with 6-8 years of experience in the semiconductor industry. Key responsibilities include managing the platform roadmap, defining strategies, and supporting product development. This role requires strong knowledge in package engineering and the ability to quickly resolve issues.
#J-18808-Ljbffr
#J-18808-Ljbffr
Apply for this Position
Ready to join Datadot Software Solution? Click the button below to submit your application.
Submit Application