Job Description

A leading semiconductor company located in Malaysia is seeking a skilled professional to lead IC package development and new product introduction. The role demands at least 5 years of experience in package/process development in semiconductor packaging, ensuring projects meet strict technical, quality, and cost requirements. Candidates should be proficient in AutoCAD and have strong analytical skills. Opportunities to drive innovations in energy-efficient technologies await you.
#J-18808-Ljbffr

Apply for this Position

Ready to join Infineon Technologies? Click the button below to submit your application.

Submit Application