Job Description

Overview

Location: Malaysia (Melaka)

Industry: Semiconductor / Power Modules / Leaded Modules / Others

We are excited to continue our search for talented Packaging Engineers who go above and beyond to deliver exceptional solutions in the semiconductor industry. You will be powering the AI & Robotics revolution.

The Human Capital is proudly partnering with a Global MNC Semiconductor Giant reshaping the industry. Their technology is the backbone of the Data Centers training the next generation of AI, the Robotics transforming logistics, and the Electric Vehicles taking over our roads.

The Role

The Hybrid Engineering Lead

We are ideally looking for someone who is passionate, curious and moving towards an Engineering Architect level who can assist to define the package design strategy and then step onto the line to prove the process. This would work together in a strong team w...

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