Job Description
Summary
Work on physical implementation of state-of-the-art SOCs at cutting edge FinFET technology nodes for various customers.
This position is for a senior-level physical design engineer who will work on
- Physical implementation of a complex SOC – Synthesis, Floorplan, P&R, Sign-off
- Work hands-on to solve critical design and execution issues related to physical design
- Own the RTL-GDS2 implementation flows, methodologies and execution of SoCs
Experience:
- Experience in all phases of the IC design process from RTL->GDS2
- Physical implementation of SoC/Full-chip-level and/or high-speed CPU/GPU/DSP cores
- Experience in high-speed, low-power, mixed-signal SoC’s is a plus
- Preferably worked on 5nm/7nm/12nm/14nm/16nm nodes at the major foundries
- Experience in developing PNR methodology/flow to and supporting a larger PDteam
- Experience in floorplanning, clocking & power network architecture and design
- Experience in low-power implementation using UPF/CPF power intent flow
- Experience in I/O Ring, RDL routing, bumps and other top-level design considerations
- Experience in LVS/DRC/ERC, EMIR (static & dynamic), LEC and Reliability sign-off checks
- Experience in STA analysis, timing closure and defining chip sign-off criterion
- Thorough understanding of digital design, timing analysis, and DFT
- Good understanding of foundation IP components – Standard cells, SRAMs etc.
- EDA Tools: Cadence (Genus, Tempus, Innovus, Voltus), Mentor (Olympus, Calibre), Synopsys (DCT, ICC2, PT-SI, Redhawk)
Qualifications:
- BTech/MTech/PhD with 4-10 years’ experience in physical implementation
- Proven track record with multiple successful final production tape-outs
- Proven ability to independently deliver results in a very fast-moving startup environment, be able to work hands-on as and guide/help peers to deliver their tasks
- Be able to work under limited supervision and take complete accountability.
- Excellent written and verbal communication skills
What's in it for you
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