Job Description

About the role:

The experienced candidate with suitable skills is required to carry out key tasks and to meet the deadline of the project. The successful candidate will work with high-power chip technology development team to design and develop state-of-the-art technology and deliver world-class high-power chips on the market.

What you will do:

  • Responsible for building a technology platform for power device (IGBT/FRD) design and new technology development to meet customer requirements in a manufacturable and cost-effective way

  • Responsible for improving the device's overall performance for the existing products, in particular, improving the device's reliability and robustness

  • Performing TCAD process and device simulations, and layout design

  • Creating and maintaining design rules and generation rules when required using controlled procedures

  • Responsible for engineering device tests (static, dynamic, reliability, etc) and data analysis, part of manual testing might be involved

  • Responsible to guide and work with chip and other function teams to meet timely deliveries

  • Train and advance the skills of existing technical employees to expand their capability and responsibility

  • Experience of IGBT design for EV/HEV application preferred

  • Encourage and manage the process of producing technical publications and invention patents.

    • What you will need:

    Hard Skills:

  • Hand-on experience in power device design and technology development, fine geometry trench and thin wafer technology is necessary, 12” experience is a plus

  • Proficiency in TCAD process and device simulation

  • Understanding of power device physics, fabrication and characterization principles

  • Knowledge and experience in design for reliability and robustness of power devices

  • Ability to address design and engineering issues and to provide suitable solutions

  • More than 8 years of working experience in IGBT (or FRD) design and/or processing

  • Proficient in reading English literature and writing in English

    • Soft Skills:

  • Leadership skills in building and leading project teams in a global, intercultural environment– “exemplified engagement”

  • Master’s degree or above, major in Microelectronics or semiconductor-related

  • Good communication skills in both oral and written English

    • Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

    Nexperia is an Equal Opportunity/Affirmative Action Employer.

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