Job Description

A leading technology firm in Singapore is seeking a candidate with extensive experience in root cause analysis and familiarity with process equipment. The ideal applicant will have at least 5 years in assembly FOL/EOL processes and hands-on expertise in SMT, Flip Chip, or other relevant technologies. Responsibilities include process definition, failure analysis, and coordinating engineering builds. This position offers an opportunity to enhance capabilities through collaboration with cross-functional teams.
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