Job Description

A global leader in innovative light and sensor solutions is seeking a candidate to develop or optimize process engineering solutions for new product development in Bayan Lepas, Malaysia. The ideal applicant should have a Degree or Master in Electrical, Electronics, Mechatronics, or Mechanical Engineering, along with 2-3 years of experience in semiconductor processes, particularly in Die Attach and Wire Bond. Familiarity with process development steps and Six Sigma methodologies is preferred.
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