Job Description

To lead IC package development and new product introduction at subcons. Ensures that technical, quality, schedule and cost requirements are achieved.

Your Role

  • Responsible for all technical aspects of new product/package/new process development.
  • Ensure that the project meets customer requirements in terms of timeline, cost and quality.
  • Provide and/or review design proposals for package including components.
  • Provide technical direction related to problem solving of process and reliability issues.
  • Close interaction with the cross functional team for new product design and project roadmaps.
  • Work closely with the subcon engineering teams to ensure process readiness and effective execution of development activities to meet Infineon project requirements.

Your Profile

  • Master / Bachelor Degree in Engineering (Minimum requirement 5 Years of Package/Process development in Semiconductor...

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