Job Description

Be the driver of Package Technology DFMEA.

Job Description

In your new role, you will:

  • Be the owner of Risk Interaction assessment and mitigation work packages.
  • Integrate unit processes (BOM and Process) in the package platform - Risk assessment, study interaction with other processes, process flow.
  • Work closely with FE in FE/BE interaction and integration topics.
  • Support pre-development activities for new chip technology.
  • Lead or participate in 8D/problem-solving for interaction issues.
  • Provide technical guidance and assistance in projects related to interaction topics.

Your Profile

You are best suited for this role if you have:

  • Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
  • Preferably 5 years of experience in the IC/semiconductor industry.
  • Knowledge of semiconductor pac...

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