Senior Staff Hardware Development Engineer (Package Design)

Staff Hardware Development Engineer (Package Design)

Location: Penang, Malaysia

Key Responsibilities

• Use Cadence tools for design, modeling and simulations. Enable timely closure of designs by getting involved with pre‑design negotiations with chip/system teams and take it to design sign off.
• Use analytical and simulation tools to define package/module design requirements (technology, stackup etc) in the project conception stages and negotiate with chip/system teams on product specification.
• Conduct routing, stack‑up & component placement studies in addition to completing the package design activities. Translate requirements (Design guidelines, technology, stackup, manufacturing time etc) for various device packaging.
• Collaborate with PCB Layout Engineers to optimize the package ballmap and chip team to optimize the die size.
• Develop multi‑signal package/module models over 50 GHz bandwidth and suitable test...