Job Description

A leading semiconductor firm in Bayan Lepas, Malaysia, seeks an experienced professional for equipment maintenance and process optimization. The role involves troubleshooting wire bonders, optimizing bonding processes, and collaborating with cross-functional teams to improve yield and quality. Candidates should hold a degree in Electrical or Mechanical Engineering and have over 5 years of relevant experience. Knowledge of wire bonder platforms and strong analytical skills are essential. The company offers opportunities for continuous improvement and cost reduction.
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