SMTS ULP CMOS Advanced Packaging TSV Integrator

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Summary of Role: The ULP CMOS product team is looking to hire a development integration engineer to join our growing Advanced packaging team in our Singapore facility. Applicants for this position would be responsible for leading process development and integration toward enabling advanced packaging new features and new offerings on base technologies in FINFET and FDSOI from early process demonstration through manufacturing transfer. Areas of focus could...