SR ENGINEER, APTD Bonding / Wafer Thinning

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Specific Responsibilities:

1. Drive improvement in wafer bonding/debonding (WSS) or wafer thinning performance.

2. Coordinate experiments for technology development and yield improvement

3. Assist advanced package technology (chip stacking, or 3D) research and development

4. Support project on-site execution and make decisions as technical consultant 

5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues

6. Generate internal and external documentation for presentations and technical reports 

Technology Development

1. Understand department and organizational goa...