Job Description
Job Description
Job Summary:
onsemi is currently seeking an experienced Process Engineer to work on product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots for ultrasonic wirebond and IVI processes for all the product groups. Lead investigation on issues / EFAR cases related to ultrasonic wire bonding process under NPI category and lead WB technology and material roadmap.
- Leading WB Set-up fo New Product Introductions
- Knowledge on Orthodyne and KNS/Power fusion wirebond platforms with deep understanding on the parameters, materials and tools.
- Establishing process windows using DOE and pareto analysis
- Ability to improve Cpk/Cp and DPMO for WB parameters
- Root‑cause analysis of bond lifts, non‑sticks, wire breaks, cratering
- Correlation of WB defects to substrate, leadframe, die, and mold compound interactions.
- D...
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