Job Description

Job Summary:

onsemi is currently seeking an experienced Process Engineer to work on product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots for ultrasonic wirebond and IVI processes for all the product groups. Lead investigation on issues / EFAR cases related to ultrasonic wire bonding process under NPI category and lead WB technology and material roadmap.

Competencies

  • Leading WB Set-up fo New Product Introductions
  • Knowledge on Orthodyne and KNS/Power fusion wirebond platforms with deep understanding on the parameters, materials and tools. 
  • Establishing process windows using DOE and pareto analysis
  • Ability to improve Cpk/Cp and DPMO for WB parameters
  • Root‑cause analysis of bond lifts, non‑sticks, wire breaks, cratering
  • Correlation of WB defects to substrate, leadframe, die, and mold compound interactions. 
  • Driving

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    Job Details

    Location
    Lapu-Lapu City, Central Visayas, Philippines
    Job Type
    Full time
    Category
    Engineers
    Posted Date
    February 06, 2026
    Deadline
    March 18, 2026