Job Description
Job Description:
Perform electromagnetic extractions on interconnects in IC Packages and PCBs, using tools such as Ansys HFSS, Q3D, SIWave, etc.,
Perform signal integrity circuit simulations on parallel digital interfaces such as DDR, analog SerDes channels and Power Delivery Networks (PDN), using tools such as ADS, Ansys Designer or HSpice.
Work closely with IC Package Design engineers for electrical design optimization of Packaging Interconnects and PDN
Work closely with IP owners, chip leads, package and PCB design engineers to optimize Bump/Ball maps of IPs and SoCs and to verify that the package electrical performance meets intended system impact targets
Perform frequency and time domain lab measurements on silicon die, bare substrates, PCBs and systems, often using micro probe stations
Contribute to the documentation of the simulation / extraction flows and Design Guidelines
Interface with substrate and assembly suppliers through the packaging team, to help d...
Perform electromagnetic extractions on interconnects in IC Packages and PCBs, using tools such as Ansys HFSS, Q3D, SIWave, etc.,
Perform signal integrity circuit simulations on parallel digital interfaces such as DDR, analog SerDes channels and Power Delivery Networks (PDN), using tools such as ADS, Ansys Designer or HSpice.
Work closely with IC Package Design engineers for electrical design optimization of Packaging Interconnects and PDN
Work closely with IP owners, chip leads, package and PCB design engineers to optimize Bump/Ball maps of IPs and SoCs and to verify that the package electrical performance meets intended system impact targets
Perform frequency and time domain lab measurements on silicon die, bare substrates, PCBs and systems, often using micro probe stations
Contribute to the documentation of the simulation / extraction flows and Design Guidelines
Interface with substrate and assembly suppliers through the packaging team, to help d...
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