Technical Product Lead (Printed Electronics and Coatings)

Responsibilities

• End-to-end product development
• Own the product roadmap for current and next-gen film (requirements, milestones, risks, trade-offs).
• Translate customer/pilot needs into PRDs, material specs, acceptance criteria, and test plans.
• Coordinate execution across R&D, engineering, and manufacturing.
• Materials + process development (hands-on + leadership)
• Lead development/optimization of transparent conductive electrodes on flexible substrates.
• Develop and test conductive inks and protective coatings/encapsulation (adhesion, abrasion, UV, moisture, soiling).
• Plan and run experiments (DOE), analyze results, and drive fast iteration.
• Manufacturing, vendors, scale-up
• Identify and qualify manufacturing routes (prototype → pilot → scalable), including roll-to-roll options.
• Own vendor/CM relationships: outreach, RFQs, sample evaluation, pilot runs, and ...