Job Description

Description

Job Summary

Performs a variety of technical tasks associated with backside wafer processing and assembly operations. This role supports production and engineering priorities in a cleanroom environment, focusing on die preparation, hybridization, wicking, and wire bonding processes.

This is a second shift position from 2:30 pm to 11:00 pm M-F.

Primary Duties & Responsibilities

  • Hybridization Support

    Clean and inspect diced die using approved solvents and cleaning methods

    As needed operate hybridization tools and maintain process parameters for yield optimization

  • Wicking & Underfill

    Perform wicking operations to ensure proper underfill application

    Monitor curing cycles and maintain accurate process logs

  • Wirebonding

    Prepare substrates, load programs, perform wirebonding

    Inspect bonds for quality and reliability using microscope...

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