Wire Bond Equipment Staff Engineer

Overview

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Responsibilities

• Equipment Maintenance & Troubleshooting: Perform preventive and corrective maintenance on wire bonders (e.g., Shinkawa, ASM, etc.). Diagnose and resolve equipment-related issues to minimize downtime. Lead root cause analysis (RCA) for recurring failures and implement corrective actions.
• Process Optimization: Optimize wire bonding parameters (e.g., force, ultrasonic power, temperature) to improve yield and throughput. Conduct DOE (Design of Experiments) to enhance process stability and performance. Work with process engineers to qualify new materials (wire types, capillaries) and bond pad designs.
• New Equipment & ...