Packaging Engineer Substrate Jobs in Hsinchu City
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Jobs Found
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Packaging Engineer
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Packaging Engineer (Substrate/FORDL)
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Packaging Engineer (Substrate)
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Engineer, Advanced Wafer Level Package
🏢 Molex
📍 North District, Hsinchu City, Taiwan
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Silicon Design Engineer
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Manager Packaging Engineering ( Substrate )
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Senior Packaging Technical Engineer - Hardware
🏢 NVIDIA
📍 Hsinchu, Taiwan, Taiwan
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Senior Packaging Technical Engineer - Hardware
🏢 Nvidia
📍 Hsinchu, Taiwan, Taiwan
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2026 Summer - ASIC Package Engineering Intern
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Packaging Engineer
🏢 Advanced Micro Devices, Inc
📍 Taiwan, Taichung City, Taiwan
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Senior substrate layout engineer
🏢 MediaTek
📍 Hsinchu City, Taiwan Province, Taiwan
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Senior Signal and Power Integrity Engineer
🏢 MediaTek
📍 Hsinchu City, Taiwan Province, Taiwan
M
Senior Package Design Engineer
🏢 MediaTek
📍 Hsinchu City, Taiwan Province, Taiwan
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Packaging Engineer
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
A
Advanced Packaging Data Analytics Engineer
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Packaging Engineer (PCB)
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Senior Principal Engineer, Technology and Innovation
🏢 Entegris
📍 Taiwan, Hsinchu City, Taiwan
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Advanced Substrate/PCB technology Expert
🏢 MediaTek
📍 Hsinchu City, Taiwan Province, Taiwan
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STCO System Architecture Technologist, up to Sr. Staff
🏢 Qualcomm
📍 Hsinchu City, Hsinchu City, Taiwan