Jobs Found

Packaging Process Engineer: NPI & Yield Focus

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Die Attach TD Module Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Die Attach TD Module Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Packaging Module Development Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Packaging Module Development Engineer

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

NPI Engineer

🏢 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft 📍 Kulim, Kedah, Malaysia
Full-time Engineering

NPI Engineer

🏢 Austria Technologie & Systemtechnik AG 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Yield Analytics Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time IT-&-Technology

Yield Analytics Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time IT-&-Technology

Senior NPI Quality Engineer (PCB/Electronics)

🏢 Austria Technologie & Systemtechnik AG 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Assembly Media and Collaterals Development Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Packaging Process Engineer - NPI & Tech Development

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Process Integration and Yield Technician

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

New Product Introduction Engineer

🏢 Ichia Technologies, INC. 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Senior Program Manager

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering