Process And Equipment Module Engineer Die Attach Or Thermal Compress Bonding Jobs in Kulim
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Jobs Found
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Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
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Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
🏢 Intel
📍 Kulim, Kedah, Malaysia
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Die Attach & Thermal Bonding Process Engineer On-Site Kulim
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
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Die Attach TD Module Engineer – NPI & Process Development
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
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Packaging Module Development Engineer
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
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Die Attach TD Module Engineer – NPI & Process Development
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
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Associate Equipment Engineer (Grinding/Dicing/LLO/Bonding)
🏢 Ams Osram
📍 Kulim, Kedah, Malaysia
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Die Attach & TCB Process Engineer - High-Volume Manufacturing
🏢 Intel
📍 Kulim, Kedah, Malaysia
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Equipment Engineer - Grinding, Dicing & Bonding
🏢 Ams Osram
📍 Kulim, Kedah, Malaysia
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Test Module Engineer: High-Volume IC & Process Optimization
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
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Module Equipment Technician (Contract)
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
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Mechanical Design Engineer (Based in Kulim High Tech Park, Kedah)
🏢 Watlow
📍 Kulim, Kedah, Malaysia
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Production Supervisor / Superintendent / Team Lead (Based at Kulim, Kedah)
🏢 Watlow
📍 Kulim, Kedah, Malaysia
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Module Equipment Technician (Contract) (Start ASAP)
🏢 Afterschool
📍 Kulim, Kedah, Malaysia
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Module Equipment Technician (Contract) – Semiconductor Maintenance
🏢 Afterschool
📍 Kulim, Kedah, Malaysia