Jobs Found

Test Module Engineer: High-Volume IC & Process Optimization

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Packaging Module Development Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Test Module Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Die Attach TD Module Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Die Attach TD Module Engineer

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Staff Test Engineer

🏢 Renesas Electronics 📍 Kulim, Kedah, Malaysia
Full-time Engineers

Process and Equipment Engineer

🏢 Intel 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Principal Engineer Product & Test Engineering

🏢 Infineon Technologies AG 📍 Kulim, Kedah, Malaysia
Full-time Engineering

Die Attach & Thermal Bonding Process Engineer On-Site Kulim

🏢 Intel Corporation 📍 Kulim, Kedah, Malaysia
Full-time Engineering