Manager Packaging Engineering Substrate Jobs in Hsinchu City
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Jobs Found
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Manager Packaging Engineering ( Substrate )
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Engineer, Advanced Wafer Level Package
🏢 Molex
📍 North District, Hsinchu City, Taiwan
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Packaging Engineer (Substrate/FORDL)
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Packaging Engineer
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Packaging Engineer (Substrate)
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Silicon Design Engineer
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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2026 Summer - ASIC Package Engineering Intern
🏢 Advanced Micro Devices, Inc
📍 Hsinchu City, Taiwan Province, Taiwan
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Senior Packaging Technical Engineer - Hardware
🏢 NVIDIA
📍 Hsinchu, Taiwan, Taiwan
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Senior Packaging Technical Engineer - Hardware
🏢 Nvidia
📍 Hsinchu, Taiwan, Taiwan
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Packaging Engineer
🏢 Advanced Micro Devices, Inc
📍 Taiwan, Taichung City, Taiwan