Packaging Engineer 2 Jobs in Singapore
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Senior Principal Engineer, Advanced Packaging
🏢 Micron Memory Malaysia Sdn Bhd
📍 Singapore, Singapore, Singapore
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Lead Silicon Photonics Packaging Engineer
🏢 STATS CHIPPAC MANAGEMENT PTE. LTD.
📍 Singapore, Singapore, Singapore
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Staff Engineer/Principal Engineer, R&D
🏢 STATS CHIPPAC MANAGEMENT PTE. LTD.
📍 Singapore, Singapore, Singapore
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Senior 2.5D Packaging Process Engineer
🏢 People Profilers Pte Ltd
📍 Singapore, Singapore, Singapore
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R&D Process Engineer / Senior Engineer (Mold)
🏢 People Profilers Pte Ltd
📍 Singapore, Singapore, Singapore
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Research Engineer (Temporary Bonding and Debonding) (APM), IME
🏢 A*STAR
📍 Singapore, Singapore, Singapore
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Research Engineer (Heterogeneous Integration), (IME)
🏢 A*STAR
📍 Singapore, Singapore, Singapore
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MTS Metrology and Inspection, ULP CMOS Advanced Packaging
🏢 Goebel Fixture Company
📍 Singapore, Singapore, Singapore
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Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering Singapore, Sin[...]
🏢 Micron Memory Malaysia Sdn Bhd
📍 Singapore, Singapore, Singapore
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Lithography Process Engineer (Manager / Senior Engineer)
🏢 Reeracoen Singapore Pte. Ltd.
📍 Singapore, Singapore, Singapore
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Senior CPIE Engineer - Packaging & Yield Leader
🏢 Micron Technology
📍 Singapore, Singapore, Singapore
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Sales and Service Engineer
🏢 ASTRO PLASMA PRIVATE LIMITED
📍 Singapore, Singapore, Singapore
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Product Compliance & Quality Engineer
🏢 Molex
📍 Singapore, Singapore, Singapore
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Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)
🏢 Micron
📍 Singapore, Singapore, Singapore
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Assembly and Packaging Process Engineer
🏢 Lyte
📍 Singapore, Singapore, Singapore
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Application Engineer
🏢 FUJIFILM Electronic Materials (Singapore) Pte. Ltd.
📍 Tuas, Tuas, Singapore
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Principal Engineer/MTS Advanced Packaging Diffusion Process Engineering
🏢 Global Foundries
📍 Woodlands, Singapore, Singapore
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Advanced Packaging Process Integration
🏢 Applied Materials South East Asia
📍 Singapore, Singapore, Singapore
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PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)
🏢 Global Foundries
📍 Woodlands, Singapore, Singapore
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Advanced Packaging Engineer
🏢 Advanced Micro Devices, Inc
📍 Singapore, Singapore, Singapore
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FDC Systems Engineer - Data-Driven Yield & Troubleshooting
🏢 United Test And Assembly Center Limited (UTAC)
📍 Singapore, Singapore, Singapore
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PROJECT MANAGER
🏢 MEIBAN MOLD MANUFACTURE PTE LTD
📍 Singapore, Singapore, Singapore
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MTS Metrology and Inspection, ULP CMOS Advanced Packaging
🏢 Global Foundries
📍 Woodlands, Singapore, Singapore
A
Advanced Packaging Process Integration Principal/ Staff Engineer
🏢 Applied Materials
📍 Singapore, Singapore, Singapore
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MTS, ULP CMOS Advanced packaging Integrator
🏢 Global Foundries
📍 Woodlands, Singapore, Singapore
A
Advanced Packaging Process Integration Principal/ Staff Engineer
🏢 Applied Materials
📍 Singapore, Singapore, Singapore