Packaging Module Development Engineer Jobs in Kulim
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Packaging Module Development Engineer
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
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Packaging Process Engineer: NPI & Yield Focus
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
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Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
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Module Equipment Technician (Contract)
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
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Die Attach TD Module Engineer – NPI & Process Development
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia
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Die Attach TD Module Engineer – NPI & Process Development
🏢 Intel Corporation
📍 Kulim, Kedah, Malaysia